文献信息

标题 A new package-related failure mechanism for leadless ceramic chip carriers (LC-3s) solder-attached to Alumina substrates
DOI 10.1016/0026-2714(83)90770-9
期刊 Microelectronics Reliability
页码 volume:23 issue:6 page:1169-1170页
时间 2008-01-26
主题 Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physic

JCR分区

类别

PHYSICS

APPLIED - SCIE

ENGINEERING

ELECTRICAL & ELECTRONIC - SCIE

NANOSCIENCE & NANOTECHNOLOGY - SCIE

分区 Q3
影响因子 1.589
引用 7,798

中科院分区

大类 工程技术-4区
小类

ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气-4区

NANOSCIENCE & NANOTECHNOLOGY 纳米科技-4区

PHYSICS, APPLIED 物理:应用-4区